| Project ID |
JSS1/RTH |
| Website |
|
| Start Date |
Fri 2003-Feb-14 12:18:38 |
| Last Updated |
Fri 2003-Feb-21 14:36:14 |
| Abstract |
The goal of this project is to use fluidic self-assembly to integrate RF CMOS chiplets onto micro-machined wells in glass. Because an insulator(glass) is used as the substrate, a high Q-factor of the inductor is expected. Another advantage is the low parasitic interconnects associated with the fluidic self-assembly process. |
| Status |
New |
| Funding Source |
Industry |
| IAB Research Area |
Package, Process & Microassembly |
| Researcher(s) |
Jack Peng |
| Advisor(s) |
John Smith, Roger T. Howe |
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