Project ID |
BPN366 |
Website |
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Start Date |
Fri 2008-Feb-15 10:07:23 |
Last Updated |
Wed 2010-Aug-11 13:10:26 |
Abstract |
The goal of this work is to deliver a sensor module with MEMS-based silicon carbide TAPS sensors integrated with SiC interface circuits for extreme harsh environment applications. |
Status |
Continuing |
Funding Source |
Federal |
IAB Research Area |
Physical Sensors & Devices |
Researcher(s) |
Benjamin Cheng |
Advisor(s) |
Albert P. Pisano |
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